PCB

     
 

4 Layer blind board
Layer:4 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥35um
Thickness:1.7mm
Surface Treatment:ENIG 1-2L,
3-4L blind

 

8 Layer buried coil board
Layer:8 Layer
Hole Copper Thickness:≥25um
Finished Copper Thickness:≥35um
Thickness:4.0mm
Surface Treatment:Lead-free HASL 1-2L, 3-4L blind resistance test , inductance test L2/3,L4/5,L6/7,L8/9 ,L10/11,L12/13 buried

 

2 Layer countersink, control depth routing board
Layer:2 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥43um
Thickness:2.4mm
Surface Treatment:ENIG countersink, control depth routing

 

10 Layer ENIG board
Layer:10 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥35um
Thickness:2.0mm
Surface Treatment:ENIG
Track width and space: 0.1mm/0.1mm, impedance
control, BGA

 

6 Layer HASL board
Layer:6 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥35um
Thickness:1.6mm
Surface Treatment:HASL impedance control

 

10 Layer HASL board
Layer:10 Layer
Hole Copper Thickness:≥25um
Finished Copper Thickness:≥35um
Thickness:2.0mm
Surface Treatment:Immersion tin
Width\Line Distance:0.1/0.1mm
Minmium Apurture:0.25mm

 

6 Layer ENIG board
Layer:6 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥35um
Thickness:1.5mm
Surface Treatment:HASL
Minmium Apurture:0.20mm

 

8Layer Immersion Gold Board
Layer:8 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥35um
Thickness:1.5mm
Surface Treatment:ENIG
Width\Line Distance:0.1/0.1mm

 

2 Layer Golder Finger board
Layer:2 Layer
Hole Copper Thickness:≥20um
Finished Copper Thickness:≥56um
Thickness:1.6mm
Surface Treatment:ENIG
Gold\Nickel Thickness:
0.05~0.15/3~5

 

4 Layer countersink hole board
Layer:4 Layer
Hole Copper Thickness:
≥20um
Finished Copper Thickness:
≥53um
Thickness:
1.0mm
Surface Treatment:
HASL

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